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  creat by art - low power loss, high efficiency - ideal for automated placement - guardring for overvoltage protection - high surge current capability - halogen-free according to iec 61249-2-21 definition molding compound, ul flammability classification rating 94v-0 base p/n with suffix "g" on packing code - halogen-free base p/n with prefix "h" on packing code - aec-q101 qualified terminal: matte tin plated leads, solderable per jesd22-b102 meet jesd 201 class 1a whisker test with prefix "h" on packing code meet jesd 201 class 2 whisker test v rrm 35 45 50 60 90 100 150 v v rms 24 31 35 42 63 70 105 v v dc 35 45 50 60 90 100 150 v i f(av) a i rrm a 0.99 0.87 1.23 1.10 dv/dt v/ s r jc o c/w t j o c t stg o c document number: d1307008 version: j13 - 55 to +150 0.1 15 10 5 a 0.65 v 0.85 a 150 symbol mbrs 20100 ct unit mbrs 20150 ct mbrs 2050 ct case: to-263ab (d 2 pak) mbrs 2035 ct mbrs 2060 ct mbrs 2090 ct polarity: as marked maximum ratings and electrical characteristics (t a =25 unless otherwise noted) mbrs 2045 ct parameter weight: 1.37 g (approximately) MBRS2035CT thru mbrs20150ct dual common cathode schottk y rectifier taiwan semiconductor mechanical data - compliant to rohs directive 2011/65/eu and in accordance to weee 2002/96/ec - moisture sensitivity level: level 1, per j-std-020 to-263ab (d 2 pak) features note 2: pulse test with pw=300 s, 1% duty cycle operating junction temperature range storage temperature range ma maximum reverse current @ rated vr t j =25 t j =125 i frm 20 - 55 to +150 note 1: tp = 2.0 s, 1.0khz voltage rate of change (rated v r ) 0.75 maximum average forward rectified current 20 peak repetitive forward current (rated vr, square wave, 20khz) peak repetitive reverse surge current (note 1) 1 0.5 0.80 0.85 maximum repetitive peak reverse voltage maximum rms voltage maximum dc blocking voltage peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load 0.57 0.70 maximum instantaneous forward voltage (note 2) i f =10a, t j =25 i f =10a, t j =125 i f =20a, t j =25 i f =20a, t j =125 i fsm v f 0.84 typical thermal resistance i r 10000 0.72 0.85 0.95 0.95 1.5 2
part no. part no. mbrs2060ct mbrs2060ct mbrs2060ct (ta=25 unless otherwise noted) document number: d1307008 version: j13 ratings and characteristics curves MBRS2035CT thru mbrs20150ct taiwan semiconductor mbrs2060ct rng rn g green compound mbrs2060cthrn h rn aec-q101 qualified preferred p/n aec-q101 qualified packing code green compound code description mbrs2060ct rn rn 50 / tube note 1: "xx" defines voltage from 35v (MBRS2035CT) to 150v (mbrs20150ct) example rn suffix "g" d 2 pak 800 / 13" paper reel c0 d 2 pak ordering information aec-q101 qualified packing code green compound code package packing mbrs20xxct (note 1) prefix "h" 0 5 10 15 20 25 50 60 70 80 90 100 110 120 130 140 150 average forward a current (a) case temperature ( o c) fig.1 forward current derating curve resistive or inductiveload 0 25 50 75 100 125 150 1 10 100 peak forward surge c urrent (a) number of cycles at 60 hz fig. 2 maximum non-repetitive forward surge current per leg 8.3ms single half sine wave jedec method 0.001 0.01 0.1 1 10 100 0 20 40 60 80 100 120 140 instantaneous reverse a current (ma) percent of rated peak reverse voltage (%) fig. 4 typical reverse characteristics per leg tj=75 tj=125 tj=25 MBRS2035CT-2045ct mbrs2050ct-20150ct 0.01 0.1 1 10 100 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 instantaneous forward a current (a) forward voltage (v) fig. 3 typical forward characteristics per leg tj=125 pulse width=300 s 1% duty cycle tj=25 MBRS2035CT-2045ct mbrs2050ct-2060ct mbrs2090ct-20150ct
min max min max a - 10.5 - 0.413 b 14.60 15.88 0.575 0.625 c 2.41 2.67 0.095 0.105 d 0.68 0.94 0.027 0.037 e 2.29 2.79 0.090 0.110 f 4.44 4.70 0.175 0.185 g 1.14 1.40 0.045 0.055 h 1.14 1.40 0.045 0.055 i 8.25 9.25 0.325 0.364 j 0.36 0.53 0.014 0.021 k 2.03 2.79 0.080 0.110 p/n = specific device code g = green compound yww = date code f = factory code document number: d1307008 version: j13 g marking diagram unit (mm) 10.8 8.3 1.1 3.5 16.9 9.5 2.5 symbol c d e a b f suggested pad layout MBRS2035CT thru mbrs20150ct taiwan semiconductor package outline dimensions dim. unit (mm) unit (inch) 0.374 0.098 unit (inch) 0.425 0.327 0.043 0.138 0.665 100 1000 10000 0.1 1 10 100 junction capacitance (pf) a reverse voltage (v) fig. 5 typical junction capacitance per leg MBRS2035CT-2045ct mbrs2050ct-20150ct f=1.0mhz vsig=50mvp-p 0.1 1 10 100 0.01 0.1 1 10 100 transient thermal impedance ( /w) t-pulse duration(s) fig. 6 typical transient thermal impedance per leg
creat by art assumes no responsibility or liability for any errors inaccuracies. information contained herein is intended to provide a product description only. no license, express or implied,to any intellectual property rights is granted by this document. except as provided in tsc's terms and conditions of sale for such products, tsc assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of tsc products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. the products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify tsc for any damages resulting from such improper use or sale. document number: d1307008 version: j13 MBRS2035CT thru mbrs20150ct taiwan semiconductor notice specifications of the products displayed herein are subject to change without notice. tsc or anyone on its behalf,


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